用银氨溶液对微米级铜粉镀银反应机理的研究
Studing on Reaction Mechanism of Silver-Plating for Micro Copper Particle
作者单位
高保娇 华北工学院化学工程系, 太原 030051 
蒋红梅 华北工学院化学工程系, 太原 030051 
张忠兴 华北工学院化学工程系, 太原 030051 
摘要: 
关键词: 微米级铜粉  镀银  吸附作用  微电池
基金项目: 
Abstract: The reaction system of silver plating for micron copper particle was studied by SEM、 XRD and other testing means.It was found that micron copper particles produce stronger absorption to complex ions [Cu(NH3)4]2+ which come from the substitution reaction. This absorption retards the substitution reaction so that Cu Ag bimetallic powders only with the plating of interspersion structure are obtained through once silver plating reaction. Besides, because of the plating of decoration structure a lot of minuteness cells form in the system, so that the plating changes into multilayer. Based on the mechanism,only if ions [Cu(NH3)4]2+ absorbed are cleaned, the reaction of silver plating goes on in order to preparating Cu Ag bimetallic powders with the plating of packaging structure.
Keywords: copper powder  silver-plating  absorption  minuteness cell
投稿时间:1999-12-06 修订日期:2000-02-01
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高保娇,蒋红梅,张忠兴.用银氨溶液对微米级铜粉镀银反应机理的研究[J].无机化学学报,2000,16(4):669-674.
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