Cu-Sn-P镀层的组成及耐腐蚀性能研究 |
STUDIES ON CONSTITUTION OF THE Cu-Sn-P ALLOY COATION AND ITS CORROSION RESISTANCE |
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摘要: 运用AES和XPS分析了Cu-Sn-P镀层的组成,研究显示Cu-Sn-P合金镀层的原子百分数为:Cu 87.42%, Sn 4.92%, P 2.85%, Fe 2.23%和O 2.52%。提出了采用1-苯基-5-巯基四氮唑(PMTA)对Cu-Sn-P镀层表面进行再处理后在镀层表面形成了薄而致密的配合物保护膜,它既增强了镀层耐10%NaCl溶液和1%H2S气体的腐蚀能力,又不影响镀层表面的金色外观,其防变色效果优于苯并三氮唑(BTA)、2-巯基苯并噻唑(MBT)和2-氨基嘧啶(2-AP)。 |
关键词: Cu-Sn-P合金组成 PMTA 耐蚀性 |
基金项目: |
Abstract: The composition of the coating of the Cu-Sn-P alloy was analyzed by using the methods of AES and XPS. The results show the coating constitution of Cu 85.42, Sn 4.92, P 2.85, Fe 2.23 and O 2.52%, which was treated with PMTA(1-phenyl-5-mercaptotetrazole), t |
Keywords: Cu-Sn-P alloy composition PMTA corrosion resistance |
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王红艳,陆旭峰,叶向荣,忻新泉.Cu-Sn-P镀层的组成及耐腐蚀性能研究[J].无机化学学报,1999,15(5):636-640. |
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