| 封孔镀铜过程中JGB作用机理研究 |
| Mechanism of JGB during Copper via Filling Process |
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| 摘要: 采用极化曲线和电化学交流阻抗法测试，研究了封孔镀铜过程中整平剂JGB的作用机理，同时利用质谱和液体核磁共振谱确定了通电过程中JGB分解产物A的结构。结果表明，JGB是一种非常不稳定的物质，在较低的阴极极化电位下JGB通过断开-N=N-双键同时加氢来实现它向产物A的转化，转化过程中JGB从电极表面脱附。相对JGB而言，产物A比较稳定，它在阴极表面的吸附强度随电位负移而增强。封孔镀过程中，因印制线路板(PCB)表面的工作电位一般都较JGB的脱附电位更负，而在此电位下，产物A可稳定吸附于电极表面，所以JGB的分 |
| 关键词: 封孔镀 JGB 分解产物 吸-脱附电位 |
| 基金项目: |
| Abstract: The mechanism of JGB during copper via filling process was investigated by means of electrochemical polarization and electrochemical impedance (EIS) measurement. The mass spectrometry (MS) and the liquid nuclear magnetic resonance spectroscopy (NMR) were employed to confirm the structure of JGB decomposed product A. These results suggest that JGB can be easily reduced to product A through breaking double bond -N=N- and adding hydrogen on the cathode surface in lower overpotential range. As a result, JGB desorbs from the cathode surface. Compared with JGB, product A is stable, and its adsorption strength is increased with the potential shifting negatively. During copper via filling process, the actual working potential of PCB is more negative than the desorption potential of JGB, but product A can be adsorbed on PCB surface stably, so product A is the real leveler for copper via filling. At the beginning of electroplating, the first reaction on PCB surface is the reduction of JGB which is adsorbed on PCB surface before electrifying, after that product A adsorbs on PCB surface and shows inhibiting effect on copper electrodeposition. |
| Keywords: via filling JGB decomposed product adsorption-desorption potential |
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| 李亚冰,王为,李永磊.封孔镀铜过程中JGB作用机理研究[J].无机化学学报,2008,24(4):534-540. |
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