| 用银氨溶液对微米级铜粉镀银反应机理的研究 |
| Studing on Reaction Mechanism of Silver-Plating for Micro Copper Particle |
|
| 摘要: |
| 关键词: 微米级铜粉 镀银 吸附作用 微电池 |
| 基金项目: |
| Abstract: The reaction system of silver plating for micron copper particle was studied by SEM、 XRD and other testing means.It was found that micron copper particles produce stronger absorption to complex ions [Cu(NH3)4]2+ which come from the substitution reaction. This absorption retards the substitution reaction so that Cu Ag bimetallic powders only with the plating of interspersion structure are obtained through once silver plating reaction. Besides, because of the plating of decoration structure a lot of minuteness cells form in the system, so that the plating changes into multilayer. Based on the mechanism,only if ions [Cu(NH3)4]2+ absorbed are cleaned, the reaction of silver plating goes on in order to preparating Cu Ag bimetallic powders with the plating of packaging structure. |
| Keywords: copper powder silver-plating absorption minuteness cell |
| 投稿时间：1999-12-06 修订日期：2000-02-01 |
| 摘要点击次数: 10293 |
| 全文下载次数: 4368 |
| 高保娇,蒋红梅,张忠兴.用银氨溶液对微米级铜粉镀银反应机理的研究[J].无机化学学报,2000,16(4):669-674. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| Support information: |
|
|
|
|
|
|
