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| Creating Collagen Nanowire Arrays by ‘Bottom-Up’ and ‘Top-Down’ Approaches on Mica Lattice Planes |
| Author Name | Affiliation | E-mail | | LI Li | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | | | ZHANG Lei | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | | | YANG De-Liang | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | | | SUN Ming | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | msun@njust.edu.cn | | ZENG Fan-Xi | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | | | GU Wen-Hua | School of Electronic Engineering and Optoelectronic Technology, Nanjing University of Science and Technology, Nanjing 210094, China | guwenhua@njust.edu.cn |
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| Abstract: By using the mica (001) lattice plane as the substrate and rat tail type Ⅰ collagen monomers as adsorbates, both ‘bottom-up’ self-assembly of protein monomers guided by the substrate and ‘top-down’ manipulation of protein membrane by AFM tip were investigated:(1) both preparation approaches can fabricate collagen nanowire arrays with precisely controllable structures; (2) the ‘bottom-up’ approach was due to the ‘reverse-phase biomineralization’ mechanism arising from the cooperative recognition and regulation between the protein and substrate at the interface; (3) the ‘top-down’ manipulation was based on the ‘molecular broom’ mechanism of the AFM tip in the Contact Mode. |
| Keywords: collagen bottom-up top-down nanowire mesoscale |
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| LI Li,ZHANG Lei,YANG De-Liang,SUN Ming,ZENG Fan-Xi,GU Wen-Hua.Creating Collagen Nanowire Arrays by ‘Bottom-Up’ and ‘Top-Down’ Approaches on Mica Lattice Planes[J].Chinese Journal of Inorganic Chemistry,2017,33(5):745-752. |
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